uxcell 1pc Aluminum Heatsink Heatsink Module Heat Diffusion Cooling Fin for High Power Amplifier Transistor Semiconductor Devices 120 x 100 x 18mm

Aluminum Heatsink: The aluminum heatsink contains 16 teeth, significantly increasing the heat dissipation area and providing excellent thermal conductivity. Large Area Heat Dissipation: The surface area design ensures contact with cooling air. The fins increase the board's surface area, allowing more heat to be transferred. Overheating Prevention: The heatsink reduces power loss in the device and provides efficient heat dissipation to electronic devices and other components, preventing overheating and damage due to excessive heat. Versatile: The aluminum chipset heatsink can be used in a variety of applications such as computers, LED lighting devices, power transistors, FETs, ICs, power amplifiers, voltage regulators, power electronic devices, and MOSFETs. Size: The dimensions of the aluminum radiator heatsink are 120 x 100 x 18mm (length*width*height). Please ensure that the heatsink size fits the size of your component.